PIC18F4620-I/ML【PDF 87/286 页】IC MCU FLASH 32KX16 44QFN

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Sheet目录3818

83页 84页 85页 86页 [87页]88页 89页 90页 91页

1996 Microchip Technology Inc.

DS30412C-page 177

PIC17C4X

Applicable Devices 42 R42 42A 43 R43 44

19.1

DC CHARACTERISTICS:

PIC17CR42/42A/43/R43/44-16 (Commercial, Industrial)

PIC17CR42/42A/43/R43/44-25 (Commercial, Industrial)

PIC17CR42/42A/43/R43/44-33 (Commercial, Industrial)

DC CHARACTERISTICS

Standard Operating Conditions (unless otherwise stated)

Operating temperature

-40C

≤ TA ≤ +85C for industrial and

≤ TA ≤ +70C for commercial

Parameter

No.

Sym

Characteristic

Min

Typ

Max

Units

Conditions

D001

VDD

Supply Voltage

4.5

–

6.0

D002

VDR

RAM Data Retention

Voltage (Note 1)

1.5 *

–

Device in SLEEP mode

D003

VPOR

VDD start voltage to

ensure internal

Power-on Reset signal

–VSS

–

See section on Power-on Reset for

details

D004

SVDD

VDD rise rate to

ensure internal

Power-on Reset signal

0.060 *

–

mV/ms See section on Power-on Reset for

details

D010

D011

D012

D013

D015

D014

IDD

Supply Current

(Note 2)

–

12 *

24 *

150

FOSC = 4 MHz (Note 4)

FOSC = 8 MHz

FOSC = 16 MHz

FOSC = 25 MHz

FOSC = 33 MHz

FOSC = 32 kHz,

WDT enabled (EC osc conguration)

D020

D021

IPD

Power-down

Current (Note 3)

–

< 1

VDD = 5.5V, WDT enabled

VDD = 5.5V, WDT disabled

These parameters are characterized but not tested.

Data in "Typ" column is at 5V, 25C unless otherwise stated. These parameters are for design guidance only

and are not tested.

Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.

2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin

loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an

impact on the current consumption.

The test conditions for all IDD measurements in active operation mode are:

OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to VDD or VSS, T0CKI = VDD,

MCLR = VDD; WDT enabled/disabled as specied.

Current consumed from the oscillator and I/O’s driving external capacitive or resistive loads needs to be con-

sidered.

For the RC oscillator, the current through the external pull-up resistor (R) can be estimated as: VDD / (2

R).

For capacitive loads, the current can be estimated (for an individual I/O pin) as (CL

VDD) f

CL = Total capacitive load on the I/O pin; f = average frequency the I/O pin switches.

The capacitive currents are most signicant when the device is congured for external execution (includes

extended microcontroller mode).

3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-

sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD and VSS.

4: For RC osc conguration, current through Rext is not included. The current through the resistor can be esti-

mated by the formula IR = VDD/2Rext (mA) with Rext in kOhm.

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